Researchers developed a reconfigurable germanium-silicon photodetector using fan-out wafer-level packaging, achieving 110+ GHz bandwidth and 112-336 Gbps data rates for AI infrastructure.
← News
Tech for Good Tech for Good Frontiers
Reconfigurable Ge-Si photodetector achieves ultrahigh-speed data transmission using low-loss packaging

110+ GHz Bandwidth
112-336 Gbps Data rate
<0.3 DB/Mm Insertion loss
>102/Mm² Interconnect density